Antenna modules and systems, and applications and methods of manufacturing thereof

ABSTRACT

Antenna modules and systems, and applications and methods of manufacturing thereof, are described herein. An example radio frequency (RF) signal transmitter includes a data signal port to receive a baseband data signal; a carrier signal port to receive an initial carrier signal; and an antenna module coupled to the signal ports. The antenna module includes: a substrate with a front face that has a phased array of active antenna elements that includes at least two columns of the active antenna elements; and a rear face that has, for each column, a RF signal launcher to receive a RF data signal for the column; and a transmitting module mounted to the rear face. The transmitting module has, for each column of active antenna elements: a combiner to form the RF data signal; and a RF signal port to transmit the RF data signal to the RF signal launcher.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application is a continuation of PCT Application No.PCT/CA2016/051016 filed on Aug. 29, 2016. The complete disclosure of PCTApplication No. PCT/CA2016/051016 is incorporated herein by reference.

FIELD

The described embodiments relate to various implementations of antennamodules and systems, and applications and methods of manufacturingthereof.

BACKGROUND

Antenna systems that operate at high frequencies can benefit fromvarious characteristics associated with high frequency datatransmissions. For example, both antenna gain and directivity varyproportionally with frequency. Operation within the Extremely HighFrequency (EHF) band (e.g., the range from 30 to 300 GHz), or themillimeter-wave band, can result in physically smaller antennas that canobtain a similar degree of directivity and gain than antennas operatingwithin lower frequency bands.

The unlicensed 60 GHz band is commonly used for high-capacity datatransmission. The 60 GHz band is located within the millimeter-wavesection of the electromagnetic spectrum and ranges from 57 to 64 GHz.Recently, the United States' Federal Communications Commission (FCC)approved the expansion of the 60 GHz band to include the frequency rangeof up to 71 GHz.

SUMMARY

The various embodiments described herein generally relate to antennamodules and systems, and applications and methods of manufacturingthereof.

In accordance with an embodiment, there is provided a radio frequencysignal transmitter having: a data signal port for receiving a basebanddata signal; a carrier signal port for receiving an initial carriersignal; and an antenna module coupled to each of the data signal portand the carrier signal port, the antenna module having: a substratehaving: a front face having a phased array of active antenna elements,the phased array of active antenna elements including at least twocolumns of the active antenna elements; and a rear face opposite thefront face, the rear face having, for each column of active antennaelements, a radio frequency (RF) signal launcher to receive a RF datasignal for the column of active antenna elements; and a transmittingmodule mounted to the rear face of the substrate, the transmittingmodule having, for each column of active antenna elements: a combiner tocombine the baseband data signal and a version of the initial carriersignal to form the RF data signal; and a RF signal port to transmit theRF data signal to the RF signal launcher.

In some embodiments, a number of active antenna elements in each columnis a power of two.

In some embodiments, each column comprises a pair of passive antennaelements positioned at opposite ends of the column.

In some embodiments, each column is positioned substantially equidistantfrom a neighboring column.

In some embodiments, each column comprises at least four active antennaelements.

In some embodiments, the transmitting module includes: a frequencymultiplier to receive the initial carrier signal from the carrier signalport and to convert the initial carrier signal to a second version ofthe initial carrier signal, wherein a frequency of the second version ofthe initial carrier signal is equal to a frequency of the initialcarrier signal multiplied by a first multiplication factor; and thecombiner forms the RF data signal using the baseband data signal and thesecond version of the initial carrier signal.

In some embodiments, the frequency multiplier converts the secondversion of the initial carrier signal to a third version of the initialcarrier signal, wherein a frequency of the third version of the initialcarrier signal is equal to the frequency of the initial carrier signalmultiplied by a second multiplication factor; and the combiner forms theRF data signal using the baseband data signal and the third version ofthe initial carrier signal.

In some embodiments, the frequency multiplier comprises a firstmultiplier stage and a second multiplier stage; and for every twocolumns of the at least two columns, the first multiplier stagecomprises a distributed local oscillator for generating the secondversion of the initial carrier signal; and for each column of the twocolumns, the second multiplier stage is coupled to the distributed localoscillator to receive the second version of the initial carrier signaland to generate the third version of the initial carrier signal.

In some embodiments, the first multiplication factor is two. In someembodiments, the second multiplication factor is four.

In some embodiments, the frequency of the version of the initial carriersignal is approximately 60 GHz.

In some embodiments, each RF signal launcher includes a stub fordirecting the RF data signal to the column of active antenna elements.

In some embodiments, the device further includes an enclosure layermounted to the front face.

In some embodiments, the enclosure layer includes a radome. In someembodiments, the enclosure layer includes a lens, positioned to enclosethe phased array of antenna elements.

In some embodiments, the rear face includes at least one spacer tomaintain a substantially uniform distance between the substrate and thetransmitting module.

In some embodiments, the spacer is positioned at each RF signallauncher.

In some embodiments, the spacer includes a solder stop.

In accordance with an embodiment, there is provided a radio frequencysignal receiver having: a data signal port for transmitting a basebanddata signal; a carrier signal port for receiving an initial carriersignal; and an antenna module coupled to each of the data signal portand the carrier signal port, the antenna module having: a substratehaving: a front face having a phased array of active antenna elements,the phased array of active antenna elements including at least twocolumns of the active antenna elements; and a rear face opposite thefront face, the rear face having, for each column of active antennaelements, a radio frequency (RF) signal launcher for receiving a RF datasignal from the column of active antenna elements; and a receivingmodule mounted to the rear face of the substrate, the receiving modulecomprising, for each column of active antenna elements: a RF signal portcoupled to the RF signal launcher to receive the RF data signal from thecolumn of active antenna elements; and a detector to retrieve thebaseband data signal from the RF data signal using a version of theinitial carrier signal.

In some embodiments, a number of active antenna elements in each columnis a power of two.

In some embodiments, each column includes a pair of passive antennaelements positioned at opposed ends of the column.

In some embodiments, each column is positioned substantially equidistantfrom a neighboring column.

In some embodiments, each column includes at least four active antennaelements.

In some embodiments, the receiving module includes: a frequencymultiplier to receive the initial carrier signal from the carrier signalport and to convert the initial carrier signal to a second version ofthe initial carrier signal, wherein a frequency of the second version ofthe initial carrier signal is equal to a frequency of the initialcarrier signal multiplied by a first multiplication factor; and thedetector retrieves the baseband data signal using the second version ofthe initial carrier signal.

In some embodiments, the frequency multiplier converts the secondversion of the initial carrier signal to a third version of the initialcarrier signal, wherein a frequency of the third version of the initialcarrier signal is equal to the frequency of the initial carrier signalmultiplied by a second multiplication factor; and the detector retrievesthe baseband data signal using the third version of the initial carriersignal.

In some embodiments, the frequency multiplier includes a firstmultiplier stage and a second multiplier stage; and for every twocolumns of the at least two columns, the first multiplier stagecomprises a distributed local oscillator for generating the secondversion of the initial carrier signal; and for each column of the twocolumns, the second multiplier stage is coupled to the distributed localoscillator to receive the second version of the initial carrier signaland to generate the third version of the initial carrier signal.

In some embodiments, the first multiplication factor is two. In someembodiments, the second multiplication factor is four.

In some embodiments, the frequency of the version of the initial carriersignal is approximately 60 GHz.

In some embodiments, each RF signal launcher includes a stub fordirecting the RF data signal to the RF signal port from the column ofactive antenna elements.

In some embodiments, the receiver includes an enclosure layer mounted tothe front face.

In some embodiments, the enclosure layer comprises a radome.

In some embodiments, the enclosure layer comprises a lens positioned toenclose the phased array of antenna elements.

In some embodiments, the rear face comprises at least one spacer tomaintain a substantially uniform distance between the substrate and thereceiving module.

In some embodiments, a spacer is positioned at each RF signal launcher.

In some embodiments, the spacer comprises a solder stop.

In accordance with an embodiment, there is provided a data communicationsystem having: a radio frequency (RF) signal transmitter having: atransmitter data signal port for receiving a baseband data signal; atransmitter carrier signal port for receiving an initial transmittercarrier signal; a transmitter substrate having: a front face having aphased array of active antenna elements, the phased array of activeantenna elements including at least two columns of the active antennaelements; and a rear face opposite the front face, the rear face having,for each column of active antenna elements, a RF signal launcher toreceive a RF data signal for the column of active antenna elements; anda transmitting module mounted to the rear face of the substrate, thetransmitting module having, for each column of active antenna elements:a combiner to combine the baseband data signal and a version of theinitial transmitter carrier signal to form the RF data signal; and a RFsignal port to transmit the RF data signal to the RF signal launcher;and at least one RF signal receiver for receiving the RF data signalfrom the RF signal transmitter.

In some embodiments, the at least one RF signal receiver includes: areceiver data signal port for receiving the RF data signal; a receivercarrier signal port for receiving an initial receiver carrier signal;and a receiver substrate having: a front face having a phased array ofactive antenna elements, the phased array of active antenna elementsincluding at least two columns of the active antenna elements; and arear face opposite the front face, the rear face having, for each columnof active antenna elements, a RF signal launcher; and a receiving modulemounted to the rear face of the receiver substrate, the receiving modulecomprising, for each column of active antenna elements: a RF signal portcoupled to the RF signal launcher to receive the RF data signal from thecolumn of active antenna elements; and a detector to retrieve thebaseband data signal from the RF data signal using a version of theinitial receiver carrier signal.

In some embodiments, the system includes a steering module operable to:select a RF signal receiver from the at least one RF signal receiver forreceiving the RF data signal from the RF signal transmitter; andgenerate a control signal for directing the RF signal transmitter totransmit the RF data signal to the selected RF signal receiver.

In some embodiments, the RF signal transmitter and the at least one RFsignal receiver form a primary communication channel; and the systemfurther includes a backchannel separate from the primary communicationchannel.

In some embodiments, the backchannel has a lower bandwidth than theprimary communication channel.

In some embodiments, the backchannel includes: an input data portcoupled to the RF signal transmitter for providing the transmitter datasignal port with the baseband data signal; and an error module coupledto each RF signal receiver for generating a response signalrepresentative of a quality of a data transmission between the RF signaltransmitter and the respective RF signal receiver, and the error moduleis coupled to the input data port to transmit the response signal to theinput data port.

In some embodiments, the backchannel operates on one of a wirelesscommunications technology and a mobile communications technology.

In accordance with an embodiment, there is provided a transceiverhaving: a radio frequency (RF) signal transmitter having: a transmitterdata signal port for receiving an outgoing baseband data signal; atransmitter carrier signal port for receiving an initial transmittercarrier signal; a transmitter substrate having: a front face having aphased array of active antenna elements, the phased array of activeantenna elements including at least two columns of the active antennaelements; and a rear face opposite the front face, the rear face having,for each column of active antenna elements, a RF signal launcher toreceive a RF data signal for the column of active antenna elements; anda transmitting module mounted to the rear face of the substrate, thetransmitting module comprising, for each column of active antennaelements: a combiner to combine the outgoing baseband data signal and aversion of the initial transmitter carrier signal to form the RF datasignal; and a RF signal port to transmit the RF data signal to the RFsignal launcher; a RF signal receiver having: a receiver data signalport for receiving an incoming RF data signal; a receiver carrier signalport for receiving an initial receiver carrier signal; and a receiversubstrate having: a front face having a phased array of active antennaelements, the phased array of active antenna elements including at leasttwo columns of the active antenna elements; and a rear face opposite thefront face, the rear face having, for each column of active antennaelements, a RF signal launcher; and a receiving module mounted to therear face of the receiver substrate, the receiving module comprising,for each column of active antenna elements: a RF signal port coupled tothe RF signal launcher to receive the incoming RF data signal from thecolumn of active antenna elements; and a detector to retrieve anincoming baseband data signal from the incoming RF data signal using aversion of the initial receiver carrier signal; and an isolatorseparating the RF signal transmitter and the RF signal receiver.

In accordance with an embodiment, there is provided a bi-directionaldata communication system having: a master transceiver formed of atransceiver as described herein; and a slave transceiver coupled tocommunicate with the master transceiver, the slave transceiver beingformed of a transceiver as described herein.

In accordance with an embodiment, there is provided a method ofproviding a radio frequency signal transmitter. The method includes:forming a phased array of active antenna elements within a substrate,the substrate having: a front face with the phased array of activeantenna elements, the phased array of active antenna elements includingat least two columns of the active antenna elements; and a rear faceopposite the front face, the rear face having, for each column of activeantenna elements, a radio frequency (RF) signal launcher to receive a RFdata signal for the column of active antenna elements; and providing adata signal port on the rear face for receiving a baseband data signal;providing a carrier signal port on the rear face for receiving aninitial carrier signal; and mounting a transmitting module to the rearface of the substrate, the transmitting module comprising, for eachcolumn of active antenna elements: a combiner to combine the basebanddata signal and a version of the initial carrier signal to form the RFdata signal; and a RF signal port to transmit the RF data signal to theRF signal launcher.

In some embodiments, mounting the transmitting module includes:providing a spacer on the rear face to maintain a substantially uniformdistance between the substrate and the transmitting module.

In accordance with an embodiment, there is provided a method ofproviding a radio frequency signal receiver. The method includes:forming a phased array of active antenna elements within a substrate,the substrate having: a front face with the phased array of activeantenna elements, the phased array of active antenna elements includingat least two columns of the active antenna elements; and a rear faceopposite the front face, the rear face having, for each column of activeantenna elements, a radio frequency (RF) signal launcher; and providinga data signal port on the rear face for receiving a RF data signal;providing a carrier signal port on the rear face for receiving aninitial carrier signal; and mounting a receiving module to the rear faceof the substrate, the receiving module comprising, for each column ofactive antenna elements: a RF signal port coupled to the RF signallauncher to receive the RF data signal from the column of active antennaelements; and a detector to retrieve a baseband data signal from the RFdata signal using a version of the initial carrier signal.

In some embodiments, mounting the receiving module includes: providing aspacer on the rear face to maintain a substantially uniform distancebetween the substrate and the receiving module.

BRIEF DESCRIPTION OF THE DRAWINGS

Several embodiments will now be described in detail with reference tothe drawings, in which:

FIG. 1 is a block diagram of components interacting with an antennamodule in accordance with an example embodiment;

FIG. 2a shows a top view of a diagram of an antenna module in accordancewith an example embodiment;

FIG. 2b shows a side view of the diagram of the antenna module of FIG. 2a;

FIG. 2c shows a rear view of the diagram of the antenna module of FIG. 2a;

FIG. 3a shows a top view of a diagram of another antenna module inaccordance with an example embodiment;

FIG. 3b shows a side view of the diagram of the antenna module of FIG. 3a;

FIG. 4 is a block diagram of an example radio frequency (RF) signaltransmitter in accordance with an example embodiment;

FIG. 5 is a schematic of a circuit of an example transmitting module, inaccordance with an example embodiment;

FIG. 6 is a schematic of a circuit of another component for the exampletransmitting module of FIG. 5, in accordance with an example embodiment;

FIG. 7 is a block diagram of an example RF signal receiver in accordancewith an example embodiment;

FIG. 8 is a schematic of a circuit of an example receiving module, inaccordance with an example embodiment;

FIG. 9 is a schematic of a rear view of an antenna module in accordancewith another example embodiment;

FIG. 10a is a top view of a substrate for an antenna module inaccordance with another example embodiment;

FIG. 10b shows a rear side of the substrate of FIG. 10 a;

FIG. 10c shows a layout for the substrate shown in FIG. 10 b;

FIG. 10d shows the substrate of FIGS. 10a to 10c mounted with an exampletransmitting module, in accordance with an example embodiment;

FIG. 11a is a partial view of the layout of FIG. 10c mounted with acomponent of an example transmitting module using a lead frame;

FIG. 11b is a partial view of the layout of FIG. 10c mounted withanother component of the example transmitting module of FIG. 11 a;

FIG. 11c shows a partial view of the schematic shown in FIG. 11b coupledwith an example spacer;

FIG. 12a is a top view of a substrate for an antenna module inaccordance with another example embodiment;

FIG. 12b shows a rear side of the substrate of FIG. 12 a;

FIG. 12c shows a layout for the substrate shown in FIG. 12 b;

FIG. 13a is a partial view of the layout shown in FIG. 12c mounted witha component of an example receiving module;

FIG. 13b is a partial view of the layout shown in FIG. 12c mounted withanother component of the example receiving module of FIG. 13 a;

FIG. 14 is a block diagram of a transceiver in accordance with anexample embodiment;

FIG. 15a is a perspective view of an example transceiver in accordancewith an example embodiment;

FIG. 15b is a top view of a printed circuit board mounted with thetransceiver of FIG. 15 a;

FIG. 16a is a schematic of a circuit for an example master transceiverin accordance with an example embodiment;

FIG. 16b is a schematic of a circuit for an example slave transceiver inaccordance with an example embodiment;

FIG. 17 is a block diagram of an example data transmission system;

FIG. 18a is a top view of a substrate manufacturing jig for an antennamodule in accordance with an example embodiment;

FIG. 18b is a side view of the substrate manufacturing jig of FIG. 18a ;and

FIG. 18c is a perspective view of the substrate manufacturing jig ofFIG. 18 a.

The drawings, described below, are provided for purposes ofillustration, and not of limitation, of the aspects and features ofvarious examples of embodiments described herein. For simplicity andclarity of illustration, elements shown in the drawings have notnecessarily been drawn to scale. The dimensions of some of the elementsmay be exaggerated relative to other elements for clarity. It will beappreciated that for simplicity and clarity of illustration, whereconsidered appropriate, reference numerals may be repeated among thedrawings to indicate corresponding or analogous elements or steps.

DESCRIPTION OF EXAMPLE EMBODIMENTS

Millimeter wave technology operates within a high frequency range of 30to 300 GHz. The 60 GHz band falls within the millimeter wave range andhas a range from 57 to 64 GHz.

The antenna modules and systems described herein can operate within themillimeter wave range. While the embodiments described herein aredirected to operation within the 60 GHz band, the described antennamodules and systems can be adapted to operate within the other bandswithin the millimeter wave technology by adjusting the carrier frequencyto the desired range.

Reference is now made to FIG. 1, which illustrates a block diagram 2 ofcomponents interacting with an antenna module 10. As shown in the blockdiagram 2, the antenna module 10 can interact with a power supply 12, aphase-lock circuit 14, a baseband module 16, and a beam steering module18.

The power supply 12 supplies power to each of the antenna module 10, thephase-lock circuit 14, the baseband module 16, and the beam steeringmodule 18. The power supply 12 can be provided as one or more separatepower supply components and each of those power supply components cansupply power to one or more of the components shown in the block diagram2.

The phase-lock circuit 14 can identify a phase difference in the initialcarrier signal (or versions of the initial carrier signal) from areference signal. The phase-lock circuit 14 can then generate an errorsignal to synchronize the carrier signal with the reference signal. Thephase-lock circuit 14 can be implemented as a phase-locked loop (PLL),in some embodiments.

The baseband module 16 can include a baseband interface for receiving aninitial carrier signal from a baseband generating module. The initialcarrier signal received from the baseband generating module can be thetransmission carrier signal, which is the carrier wave at which theantenna module 10 is designed to transmit or receive data. The initialcarrier signal received from the baseband generating module can be afraction of the transmission carrier signal, and the antenna module 10can apply one or more multiplication factors to convert the initialcarrier signal to the transmission carrier signal.

The beam steering module 18 can generate control signals to direct a RFsignal transmitter to transmit a RF data signal to one or more RF signalreceivers that are located apart from the RF signal transmitter. Thebeam steering module 18 can identify the corresponding RF signalreceivers from a look-up table, for example. The look-up table defines asteering range between the RF signal transmitter and each RF signalreceiver, as well as a set out voltage for the phase shifter. A steeringrange in which the RF signal transmitter can direct the RF data signalat be at least ±30 degrees from boresight, in some embodiments.

For example, when multiple RF signal receivers are available within adata transmission system, the beam steering module 18 can select one ormore RF signal receivers that are most suitable to receive the RF datasignal from the antenna module 10, which can be a RF signal transmitteror a transceiver. Based on the selection of the RF signal receiver, thebeam steering module 18 can generate a control signal to direct theantenna module 10 to transmit the RF data signal to the selected RFsignal receiver.

In some embodiments, the beam steering module 18 can generate differentcontrol signals for each column of the active antenna elements at theantenna module 10 so that a different degree of steering can result.

The antenna module 10 can be a RF signal transmitter, RF signalreceiver, or a transceiver. Depending on the design of the antennamodule 10, the antenna module 10 can transmit and/or receive datasignals according to the data signals provided by each of the phase-lockcircuit 14, the baseband module 16, and the beam steering module 18.

Example embodiments of the antenna module 10 will be described hereinwith reference to at least FIGS. 2a to 13 b.

FIG. 2a shows a top view 50 a of an example antenna module 50, FIG. 2bshows a side view 50 b of the antenna module 50, and FIG. 2c shows arear view 50 c of the antenna module 50.

The antenna module 50 includes a substrate 52 with a front face 54 and arear face 56 opposite the front face 54. As shown in FIGS. 2a and 2b ,the front face 54 includes a phased array 60 of antenna elements that isembedded within the substrate 52. The phased array 60 can also bereferred to as substrate integrated waveguide (SIW) or activeelectronically scanned array (AESA). The phased array 60 includes anarray of antennas in which the relative phases of the signals that arefed to each active antenna element 64 can be steered towards desireddirections.

The phased array 60 of antenna elements is structured into at least twocolumns 66, such as columns 66 a to 66 d shown in FIG. 2a . Each column66 includes active antenna elements 64 and a pair of passive antennaelements 62 that are positioned at opposite ends of each column 66. Thenumber of active antenna elements in each column varies with thestructure of the phased array 60. In some embodiments, the number ofactive antenna elements in each column is a power of two.

When the antenna module 50 is designed to be a RF signal transmitter,the active antenna elements 64 operate to radiate the RF data signalaway from the antenna module 50. When the antenna module 50 is designedto be a RF signal receiver, the active antenna elements 64 operate toreceive the RF data signal.

The passive antenna elements 62 act as resistive terminators for eachcolumn 66. Each passive antenna element 62 can have a resistance of 50Ω,for example. In the example shown in FIGS. 2a to 2c , each column 66includes four active antenna elements 64. The number of columns 66 canvary with the intended application of the antenna module 50. Forexample, the dimension of the antenna elements 64 can depend on a centerfrequency for which the antenna module 50 is designed. For example,other dimensions of the antenna elements 64 can include rectangularstructures, such as eight columns with eight antenna elements 64 each,or sixteen columns with sixteen antenna elements 64 each. When thenumber of columns 66 increases, the overall antenna gain can increaseand the beam width can be narrowed. As a result, the RF data signal tobe transmitted by the active antenna elements 64 can be steered withgreater accuracy.

As shown in FIGS. 2a to 2c , each column 66 is positioned substantiallyequidistant from its neighboring column 66. A column distance 68 betweenneighboring columns 66 can be approximately half the wavelength of thecarrier frequency for which the antenna module 50 is designed. Forexample, when the antenna module 50 is designed for a carrier frequencyof 60 GHz, the column distance 68 can be 2.5 mm since the wavelength is5 mm. The column distance 68 is measured from a center of one column 66to a center of its neighboring column 66.

In some embodiments, the column distance 68 can vary between each pairof neighboring columns 66. The column distance 68 may decrease movingfrom the center of the substrate 52 to either edge of the substrate 52.For example, a column distance 68 between columns 66 b and 66 c can begreater than a column distance 68 between each of columns 66 b and 66 a,and columns 66 c and 66 d.

As shown in FIGS. 2b and 2c , the rear face 56 is mounted with a RFmodule 80. Depending on the application of the antenna module 50, the RFmodule 80 can be a transmitting module or a receiving module. Exampleembodiments of the transmitting module and the receiving module will bedescribed with reference to, at least, FIGS. 4 to 13 b.

FIGS. 3a and 3c show another example embodiment of the antenna module 50shown in FIGS. 2a to 2 c.

FIG. 3a shows a top view 50 a′ of an example antenna module 50′ and FIG.3b shows a side view 50 b′ of the antenna module 50′. The antenna module50′ includes a lens 70 as an enclosure layer. The lens 70 encloses thephased array of antenna elements 60. The lens 70 can improve a gain ofthe active antenna elements 64 by focusing the beam radiating from theactive antenna elements 64. The lens 70 can also increase a range of thesteering angle.

The enclosure layer can protect the phased array 60 from any harmfuleffects resulting from being exposed to the environment, such ashumidity, dust, and other related effects.

In some embodiments, the enclosure layer may be formed as a radome thatis mounted to the front face 54. The radome can be mounted at the edgesof the front face 54 to avoid affecting the operation of the phasedarray 60. The radome may be formed with Mylar™, for example.

The enclosure layer is optional. The antenna module 50 may be located ina relatively clean environment, or any resulting effect of theenvironment will have minimal impairment to the operation of the antennamodule 50. The antenna module 50 may be placed into a protective casethat can limit the effect of the environment.

In some other embodiments, instead of mounting an enclosure layer to thefront face 54, a silicon edge sealant can be applied to the front face54 to act as physical protection for the phased array 60.

FIG. 4 is a block diagram of an example RF signal transmitter 100.

The RF signal transmitter 100 includes a data signal port 102 forreceiving a baseband data signal 112, a carrier signal port 104 forreceiving an initial carrier signal 114, a substrate 150 with a frontface 154 opposite to a rear face 156, and a transmitting module 180.

The initial carrier signal 114 can be the transmission carrier signal,or a version of the transmission carrier signal. For example, if the RFsignal transmitter 100 is designed to operate within the 60 GHz band,the initial carrier signal 114 received at the carrier signal port 104can be the transmission carrier signal (e.g., 60 GHz), or a version ofthe transmission carrier signal. The version of the transmission carriersignal can be a fraction of the transmission carrier signal, such ashalf of the transmission carrier signal or a quarter of the transmissioncarrier signal.

When the RF signal transmitter 100 receives a version of thetransmission carrier signal as the initial carrier signal 114, thetransmitting module 180 can multiply the received version of thetransmission carrier signal to generate the transmission carrier signal.The multiplication stage can include one or more stages.

As described with reference to FIGS. 2a to 2c , the front face 154 has aphased array 60 of active antenna elements 64. The active antennaelements 64 are structured into one or more columns 66. In the RF signaltransmitter 100, a transmitting module 180 is mounted to the rear face156 for each column 166 of active antenna elements 64.

The transmitting module 180 includes a combiner 182 that receives thebaseband data signal 112 from the data signal port 102 and the initialcarrier signal 114 from the carrier signal port 104. The combiner 182can modulate the baseband data signal 112 and a version of the initialcarrier signal 114 to form a RF data signal 116. The version of theinitial carrier signal 114 modulated with the baseband data signal 112is the transmission carrier signal. In the embodiments in which theinitial carrier signal 114 is not the transmission carrier signal, thecombiner 182 can include at least one of the multiplication stages forgenerating the transmission carrier signal from the initial carriersignal 114 or a version of the initial carrier signal.

The combiner 182 then couples the RF data signal 116 to a RF signal port106. The RF signal port 106 transmits the RF data signal to a RF signallauncher 170 formed on the rear face 156 of the substrate 150. The rearface 156 includes a RF signal launcher 170 for each column 166 of activeantenna elements 64. Each RF signal launcher 170 receives the RF datasignal 116 from the RF signal port 106 and couples the RF data signal116 to the respective column 166 of active antenna elements 64.

FIG. 5 is a schematic of a circuit of an example transmitting module182′.

The example transmitting module 182′ includes a frequency multiplier120, a mixer 130 and a power amplifier 132.

The frequency multiplier 120 includes a carrier signal port 104′ coupledto a first amplifier 122, a phased shift injection push-push oscillator(PSIPPO) 124, and a second amplifier 126.

The PSIPPO can include a power divider, a time delay unit, a bandrejection filter (“BRF”), at least two reflection amplifiers, and apower combiner.

The PSIPPO can receive an input signal with an input signal phase andcan then generate an output signal with an output signal phase. Theoutput signal phase can be the same or difference phase from the inputsignal phase. For example, depending on the design of the PSIPPO, theoutput signal can have twice the frequency and about twice the phaseangle of the input signal.

In an example implementation of the PSIPPO, the power divider canreceive the input signal and inject a first portion of the input signalinto the band rejection filter. The power divider can inject a secondportion of the input signal into the band rejection filter via the timedelay unit. The time delay unit can cause a time delay of about half aperiod of the input signal. The signals being injected into the bandrejection filter have the same power level but are opposite in phase.

The band rejection filter generates a first band filtered signal and asecond band filtered signal. A phase of the first and second bandfiltered signals with respect to the input signal can be shifted in therange of about ±100 degrees. Each of the first and second band filteredsignals is fed to a respective reflection amplifier, which generatesfirst and second modified output signals.

The first and second modified output signals are fed to a combiner,which generates the output signal for the PSIPPO.

Referring still to FIG. 5, the first amplifier 122 modulates the initialcarrier signal 114 received at the carrier signal port 104′. The PSIPPO124 converts the initial carrier signal 114 by applying a firstmultiplication factor to generate a second version of the initialcarrier signal 114, or converts a version of the initial carrier signal114 by applying a second multiplication factor to generate a thirdversion of the initial carrier signal 114. The second amplifier 126receives the output signal from the PSIPPO 124.

The carrier signal port 104′ may be coupled to the carrier signal port104 and receives the initial carrier signal 114. The frequencymultiplier 120 can apply a first multiplication factor to the initialcarrier signal 114 received at the carrier signal port 104′ to convertthe initial carrier signal 114 to a second version of the initialcarrier signal 114. For example, when the RF signal transmitter 100 isdesigned to operate at a transmission carrier signal of 60 GHz and theinitial carrier signal 114 is 30 GHz, the frequency multiplier 120 canapply a first multiplication factor of two to the initial carrier signal114 to generate the second version of the initial carrier signal 114(e.g., doubling the initial carrier signal 114), which is thetransmission carrier signal. In another example, the initial carriersignal 114 can be 15 GHz and the frequency multiplier 120 can then applya first multiplication factor of four to the initial carrier signal 114to generate the second version of the initial carrier signal 114. Othermultiplication factors may be applied as necessary.

In some other embodiments, the carrier signal port 104′ may receive aversion of the initial carrier signal 114. The initial carrier signal114 may first be transmitted to another component and converted to thesecond version of the initial carrier signal 114 with the application ofa first multiplication factor, and the second version of the initialcarrier signal 114 is provided to the frequency multiplier 120 togenerate a third version of the initial carrier signal 114 with theapplication of a second multiplication factor.

FIG. 6 shows a schematic of an example circuit for a frequencymultiplier 140 that can generate the second version of the initialcarrier signal 114 and provide the second version of the initial carriersignal 114 to the frequency multiplier 120.

The frequency multiplier 140 includes a PSIPPO 142, an amplifier 144,and a power divider 146. The frequency multiplier 140 shown in FIG. 6 isintended to provide the second versions of the initial carrier signals114 to a pair of transmitting modules 182′.

The frequency multiplier 140 has a carrier signal port 104″ that may becoupled to the carrier signal port 104 to receive the initial carriersignal 114. The PSIPPO 142 converts the initial carrier signal 114received at the carrier signal port 104″ to a second version of theinitial carrier signal 114 by multiplying a frequency of the receivedinitial carrier signal 114 by a first multiplication factor. Theamplifier 144 receives the second version of the initial carrier signal114 from the PSIPPO 142 and transmits the second version of the initialcarrier signal 114 to the power divider 146.

The power divider 146 can generate a pair of the second version of theinitial carrier signal 114 for two respective transmitting modules at104′. The power divider 146 can be implemented with differentcomponents, such as a Wilkinson Power Divider.

In an example embodiment, when the RF signal transmitter 100 is designedto operate at a transmission carrier signal of 60 GHz and the initialcarrier signal 114 is 15 GHz, the frequency multiplier 140 can apply afirst multiplication factor of two to the initial carrier signal 114 togenerate the second version of the initial carrier signal 114 (e.g., 30GHz). The second version of the initial carrier signal 114 can then betransmitted to the frequency multiplier 120. The frequency multiplier120 can convert the second version of the initial carrier signal 114 togenerate a third version of the initial carrier signal 114 by applying asecond multiplication factor. A frequency of the third version of theinitial carrier signal 114 can be a frequency of the initial carriersignal 114 multiplied by a second multiplication factor. In thisexample, the second multiplication factor can be four so that the thirdversion of the initial carrier signal 114 is converted to thetransmission carrier signal at 60 GHz.

The frequency multiplier 140, in some embodiments, may be implemented asa distributed local oscillator (“DLO”).

The frequency multiplier 120 transmits a version of the initial carriersignal 114 to the mixer 130. The mixer 130 includes three terminals, alocal oscillator terminal (“L”) coupled to the frequency multiplier 120for receiving the version of the initial carrier signal 114, a basebandterminal (“I”) 102′ coupled to the data signal port 102 for receivingthe baseband data signal 112, and a RF signal terminal (“R”) fortransmitting the RF data signal 116 to the power amplifier 132 totransmit to the RF signal port 106.

The baseband data signal 112 received at the data signal port 102 mayhave a frequency within a range of approximately 3 GHz. The mixer 130can modulate the baseband data signal 112 into the transmission carriersignal to generate the RF data signal 116.

FIG. 7 is a block diagram of an example RF signal receiver 200.

The RF signal receiver 200 includes a substrate 250 with a front face254 opposite to a rear face 256, and a receiving module 280. At thereceiving module 280, there is a data signal port 202 for transmitting abaseband data signal 112 from the RF signal receiver 200, and a carriersignal port 204 for receiving an initial carrier signal 214.

The front face 254 has a phased array 60 of active antenna elements 64.The active antenna elements 64 are structured into one or more columns266. In the RF signal receiver 200, a RF signal launcher 270 is mountedto the rear face 256 for each column 266 of active antenna elements 64.The RF signal launcher 270 receives the RF data signal from therespective column 266 of active antenna elements 64 and transmits the RFdata signal 216 to the RF signal port 206 coupled to the RF signallauncher 270.

For each column 266, the receiving module 280 includes a detector 282that retrieves the baseband data signal 212 from the RF data signal 216using a version of the initial carrier signal 114.

Similar to the RF signal transmitter 100, the initial carrier signal 214can be the transmission carrier signal, or a fraction of thetransmission carrier signal. For example, if the RF signal receiver 200is designed to operate within the 60 GHz band, the initial carriersignal 214 received at the carrier signal port 204 can be thetransmission carrier signal (e.g., 60 GHz), or a fraction of thetransmission carrier signal.

FIG. 8 shows a schematic of a circuit of an example receiving module282′. The receiving module 282′ includes a frequency multiplier 220, amixer 230, a phase detector 240, and a power amplifier 232.

The frequency multiplier 220 of FIG. 8 is similar to the frequencymultiplier 120 of FIG. 5. The frequency multiplier 220 includes acarrier signal port 204′ coupled to a first amplifier 222, a PSIPPO 224,and a second amplifier 226.

The first amplifier 222 receives the initial carrier signal 214 from thecarrier signal port 204′. The PSIPPO 224 converts the initial carriersignal 214 by applying a first multiplication factor to generate asecond version of the initial carrier signal 214, or converts a versionof the initial carrier signal 214 by applying a second multiplicationfactor to generate a third version of the initial carrier signal 214.The second amplifier 226 receives the version of the initial carriersignal 214 from the PSIPPO 224.

In some embodiments, the frequency multiplier 140 shown in FIG. 6 canalso be provided at RF signal transmitter 100 to generate a secondversion of the initial carrier signal 214 for the receiving module 282′.The frequency multiplier 140 can act as a first stage multiplier and thefrequency multiplier 220 can act as a second stage multiplier.

The mixer 230 has a local oscillator terminal (“L”) coupled to thefrequency multiplier 220 for receiving the version of the initialcarrier signal 214, a baseband terminal (“I”) 202′ coupled to the datasignal port 202 for transmitting the retrieved baseband data signal 212,and a RF signal terminal (“R”) for receiving the RF data signal 216 fromthe RF signal port 206′ via the power amplifier 232. The RF signal port206′ receives the RF data signal 216 from the RF signal port 206 shownin FIG. 7.

When the RF data signal 216 is received at the RF signal terminal (“R”),the mixer 230 retrieves the baseband data signal 212 using the versionof the initial carrier signal 214 received at the local oscillatorterminal (“L”). The mixer 230 then transmits the baseband data signal212 from the baseband terminal (“I”) 202′.

The phase detector 240 provides coherent detection through phaselocking. By incorporating coherent detection into the receiving module282′, the exact carrier can be locked. The phase detector 240 operatesto ensure that the version of the initial carrier signal 214 received atthe local oscillator terminal (“L”) corresponds to a desired phase.

The phase detector 240 has a phase detector input terminal 242, areference terminal 244, and a phase detector output terminal 246. Thephase detector input terminal 242 receives the RF data signal 216 and areference signal (“REF”), and the reference terminal 244 also receivesthe reference signal (“REF”). By comparing the phase of each of the RFdata signal 216 and the reference signal, the phase detector 240 candetermine whether there is a phase difference between the RF data signal216 and the reference signal, and generate an error signal representingthe phase difference at the phase detector output terminal 246. In someembodiments, REF may be ground.

The phase detector output terminal 246 is coupled to a free runningvoltage-controlled oscillator (VCO) that generates a frequency accordingto the error signal. For example, the VCO can provide a nominal 15 GHz.

The RF signal transmitter 100 and RF signal receiver 200 can beimplemented with different structures described with reference to, atleast, FIGS. 9 to 13 b.

FIG. 9 is a schematic diagram of a rear view of an antenna module 300.

The antenna module 300 has a substrate 302 with a rear face 306 on whichRF modules 308 a to 308 d are mounted. The RF modules 308 a to 308 d canbe transmitting modules or receiving modules depending on the design ofthe antenna module 300.

Each of the RF modules 308 a to 308 d is coupled to a respective RFsignal launcher 320 a to 320 d via a coupling element 310 a to 310 d,respectively. Each subsequent RF module 308 a to 308 d is positioned ata 180° offset from the other. A phase shift of 45° can be applied to theinitial carrier signal 114 to compensate for the 180° offset.

As shown in FIG. 9, the RF signal launchers 320 a to 320 d are providedas a stub. Each stub 320 a to 320 d couples the respective RF module 308a to 308 d to the column 66 of active antenna elements 64. Column ports316 a to 316 d are shown on FIG. 9. Each column port 316 connects to apower of two number of active antenna elements 64.

The stub 320 can be printed onto the rear face 306 of the substrate 302,and aligned with the respective column port 316. The stub 320 is formedwith a dimension that can match the impedance of the space with which itwill interact. For example, when the rear face 306 is exposed to freespace, the stub 320 can be formed with a dimension that can provide 350to match the impedance of free space.

The substrate 302 can be formed with multiple layers that alternatebetween ground planes and signal carrying layers. The substrate 302 maybe formed with stripline technology. For example, the substrate 302 canbe formed from a first set of layers that form the phased array 60, anda second set of layers that form the interconnect layers between thephased array 60 and the RF modules 308.

Each layer can be formed using FERRO™'S A6 low temperature co-firedceramic (LTCC) system. The metallic elements in each of the layers maybe formed of various different materials, such as gold or silver. Themetallic elements on the final interface layer (e.g., the rear face 306)can be formed of a material that is more reliable for solder attachment,such as silver-platinum (AgPt).

The interconnect layers include the layer forming the rear face 306 ofthe substrate 302 and are substantially RF transparent. Aligning eachstub 320 a to 320 d with the respective column port 316 a to 316 dfacilitates direct insertion of the RF data signal 116 to the respectivecolumn 166 or direct reception of the RF data signal 216 from therespective column 266.

When the RF modules 308 a to 308 d are transmitting modules, the RFsignal launcher 320 a to 320 d directs the RF data signal 116 from theRF modules 308 a to 308 d to a respective column 66 of active antennaelements 64. When the RF modules 308 a to 308 d are receiving modules,the RF signal launcher 320 a to 320 d receives the RF data signal 216from respective column 66 of active antenna elements 64 and directs theRF data signal 216 to the RF modules 308 a to 308 d.

Another example embodiment of the RF signal transmitter 100 and the RFsignal receiver 200 are described with reference to FIGS. 10a to 13 b.

FIG. 10a is a top view 350 a of a substrate 352 for an antenna module350, and FIG. 10b is a rear view 350 b of the substrate 352. Thesubstrate 352 has a front face 354 and a rear face 356.

The front face 354 has a phased array 360 of antenna elements 364 formedin columns 366, namely columns 366 a to 366 d. Each column 366 isterminated by a pair of passive elements 362. Each neighboring column366 is separated from each other by a column distance 368. The columndistance 368 for the example substrate 352 shown in FIG. 10a issubstantially equidistant. In some other embodiments, the columndistance 368 may vary.

As shown in FIG. 10a , the substrate 352 also includes grooves 390between each neighboring columns 366 and a pair of grooves 392 betweeneach neighboring antenna elements 362, 364. The grooves 390 and 392provide isolation for each of the antenna elements 362, 364. The grooves390 and 392 may be formed with a diamond turning process, for example.The dimension of the grooves 390 and 392 vary with the intended carrierwave for which the antenna module 350 is designed.

The RF modules 180, 280 can be mounted to the substrate 352 directly,such as with flip chip mounting. The RF modules 180, 280 may be mountedusing ball grid array (BGA).

When the RF modules 180, 280 are directly mounted to the substrate 352,a spacing between the RF module 180, 280 and the substrate 352 can bemore accurately controlled, such as with a solder stop (as will bedescribed with reference to FIG. 11c ). The spacing between the RFmodule 180, 280 and the substrate 352 provide an air gap. A dimension ofthe air gap can be designed to provide a resistance range ofapproximately 25 to 100Ω, for example. Wire bonding can involve thickbonds that can generate dielectric losses. Direct bonding, on the otherhand, offer low inductance due to the coupling between the RF module 380and the substrate 352.

Referring now to FIG. 10b , the rear face 356 is formed for receiving atransmitting module 180. FIGS. 12a to 12c show an example antenna module450 for receiving a receiving module 280, and will be described.

FIG. 10c shows a layout for the rear side 350 b shown in FIG. 10b , andFIG. 10d shows, at 350 b′, the substrate 352 mounted with an exampletransmitting module 380.

The substrate 352 is formed to receive a transmitting module 380 formedof a first stage multiplier, such as 140 shown in FIG. 6, and atransmitter circuit having a second stage multiplier, such as 182′ shownin FIG. 5. The transmitting module 380 includes two first stagefrequency multiplier 382 a and 382 b. Each of the first stage frequencymultipliers 382 a and 382 b drives two transmitter circuits, namely 384a and 384 c, and 384 b and 384 d, respectively.

Shown generally at 394 a and 394 b on FIG. 10c are areas on thesubstrate 352 for receiving the first stage frequency multipliers 382 aand 382 b, respectively. RF signal launchers 370 a to 370 d are formedon the rear face 356 of the substrate 352. A RF signal launcher 370 isprovided for each column 366 of active antenna elements 364. Each RFsignal launcher 370 a to 370 d includes a corresponding stub 372 a to372 d.

FIG. 11a is a partial view 342 of the layout of FIG. 10b with the firststage frequency multiplier 382 a mounted. A carrier signal port 404 a isprovided on the substrate 352 for receiving the initial carrier signal114. The first stage frequency multiplier 382 a receives the initialcarrier signal 114 from the carrier signal port 404 a. The first stagefrequency multiplier 382 a converts the initial carrier signal 114 to asecond version of the initial carrier signal 114, and transmits thesecond version of the initial carrier signal to each of the carriersignal ports 404 a′. As shown on FIG. 10c , the area shown generally at394 b also includes a carrier signal port 404 b for receiving theinitial carrier signal 114 for the first stage frequency multiplier 382b to be mounted, and a pair of carrier signal ports 404 b′ for receivingthe second version of the initial carrier signal 114 from the firststage frequency multiplier 382 b.

FIG. 11b is a partial view 344 of the layout of FIG. 10b with thetransmitter circuit 384 a mounted. The carrier signal port 404 a′receives the second version of the initial carrier signal from the firststage frequency multiplier 382 a. The transmitter circuit 384 a alsoreceives the baseband data signal 112 from a data signal port 402. Thetransmitter circuit 384 a converts the second version of the initialcarrier signal to a third version of the initial carrier signal, andmodulates the baseband data signal 112 with the third version of theinitial carrier signal to generate the RF data signal 116. Thetransmitter circuit 384 a then transmits the RF data signal 116 to theRF signal launcher 370 a via the stub 372 a.

From FIGS. 10c and 10d , it can be seen that a data signal port 402 andcarrier signal port 404 a′ are also provided for coupling thetransmitter circuit 384 c. Similarly, a data signal port 402 and carriersignal port 404 b′ are provided for each of the transmitter circuits 384b and 384 d, respectively.

As shown in FIG. 10d , the transmitter circuit 384 a is aligned with theRF signal launcher 370 a, the transmitter circuit 384 b is aligned withthe RF signal launcher 370 b, the transmitter circuit 384 c is alignedwith the RF signal launcher 370 c, and the transmitter circuit 384 d isaligned with the RF signal launcher 370 d. The RF signal launcher 370 atransmits the RF data signal 116 to the column 366 a, the RF signallauncher 370 b transmits the RF data signal 116 to the column 366 b, theRF signal launcher 370 c transmits the RF data signal 116 to the column366 c, and the RF signal launcher 370 d transmits the RF data signal 116to the column 366 d.

FIG. 11c shows a partial view 346 of the layout of FIG. 10b with anexample spacer 374 provided thereon.

A spacer 374 can be positioned at each RF signal launcher 370, such asRF signal launcher 370 a, to control the spacing between the rear face356 and the transmitter circuit 384 a to be mounted thereon. Byoptimizing the spacing between the rear face 356 and the transmittercircuit 384 a, electrical and dielectric losses can be minimized toprevent dielectric and ohmic coupling and losses. The dimension of thespacing can vary with the dimensions of the RF signal launcher 370 aand/or the transmitter circuit 384 a mounted thereon. The spacing can bedesigned to have a range of approximately 25 to 100 μm, for example.

The spacer 374 can be provided as a solder stop formed of a cured soldermaterial. The spacer 374 can act as a boundary for the pins of the RFsignal launcher 370, as shown in FIG. 11c , that connect with thetransmitter circuit 384 a. When the transmitter circuit 384 a is mountedto the substrate 352, the solder can expand and possibly run. Withoutthe spacer 374, the solder can run beyond the pins on the substrate 352and the resulting connection between the transmitter circuit 384 a andthe substrate 352 can be uneven and/or unstable. With the spacer 374,the solder is prevented from running beyond a certain area.

The spacer 374 also controls the amount of solder between thetransmitter circuit 384 a and the substrate 352 so that the distancebetween the transmitter circuit 384 a and the substrate 352 can besubstantially uniform.

The solder used to mount the transmitter circuit 384 a to the substrate352 can be formed of C4 solder balls. The C4 solder balls can becomposed of SAC305, which is a lead-free alloy that contains 96.5% tin,3% silver, and 0.5% copper.

FIG. 12a is a top view 450 a of a substrate 452 for an antenna module450, and FIG. 12b is a rear view 450 b of the substrate 452. Thesubstrate 452 has a front face 454 and a rear face 456.

Similar to the antenna module 350 shown in FIGS. 10a and 10b , the frontface 454 has a phased array 460 of antenna elements 464 formed incolumns 466, namely columns 466 a to 466 d. Each column 466 isterminated by a pair of passive elements 462. Each neighboring column466 is separated from each other by a column distance 468. The columndistance 468 for the example substrate 452 shown in FIG. 12a issubstantially equidistant. In some other embodiments, the columndistance 468 may vary.

FIG. 12c shows a layout 450 for a rear side of another substrate 452 forthe antenna module 350 of FIG. 10a . The substrate 452 is formed toreceive a receiving module 280.

The receiving module 280 is formed of a first stage frequencymultiplier, such as 140 shown in FIG. 6, and a receiver circuit having asecond stage frequency multiplier, such as 282′ shown in FIG. 8. Thereceiving module 280 includes a first and second frequency multiplier.An example first frequency multiplier is shown at 482 a in FIG. 13a .Each of the first stage frequency multipliers drives two receivercircuits. An example receiver circuit driven by the first stagefrequency multiplier 482 a is shown at 484 a in FIG. 13 b.

Shown generally at 494 a and 494 b on FIG. 12c are areas on thesubstrate 452 for receiving the first stage frequency multipliers, suchas 482 a, respectively. RF signal launchers 470 a to 470 d are formed onthe rear face 456. A RF signal launcher 470 is provided for each column366 of active antenna elements 364. Each RF signal launcher 470 a to 470d includes a corresponding stub 472 a to 472 d.

FIG. 13a is a partial view 442 of the layout shown in FIG. 12c with thefirst stage frequency multiplier 482 a mounted.

A carrier signal port 504 a is provided on the substrate 452 forreceiving the initial carrier signal 214. The first stage frequencymultiplier 482 a receives the initial carrier signal 214 from thecarrier signal port 504 a. The first stage frequency multiplier 482 aconverts the initial carrier signal 214 to a second version of theinitial carrier signal 214, and transmits the second version of theinitial carrier signal 214 to each of the carrier signal ports 504 a′.As shown on FIG. 12c , the area shown generally at 494 b also includes acarrier signal port 504 b for receiving the initial carrier signal 214for the first stage frequency multiplier 482 b to be mounted, and a pairof carrier signal ports 504 b′ for receiving the second version of theinitial carrier signal 214 from the first stage frequency multiplier 482b.

FIG. 13b is a partial view 444 of the layout shown in FIG. 12c with thereceiver circuit 484 a mounted. The carrier signal port 504 a′ receivesthe second version of the initial carrier signal 214 from the firststage frequency multiplier 482 a, and converts the second version of theinitial carrier signal 214 to a third version of the initial carriersignal 214. The receiver circuit 484 a receives the RF data signal 216from the RF signal launcher 470 a via the stub 472 a. Using the thirdversion of the initial carrier signal 214, the receiver circuit 484 aretrieves the baseband data signal 212 from the RF data signal 216, andtransmits the baseband data signal 212 via the data signal port 502.

As shown on FIG. 12c , a data signal port 402 and carrier signal port504 a′ are also provided for coupling a receiver circuit 484 c.Similarly, a data signal port 502 and carrier signal port 504 b′ areprovided for each of the receiver circuits 484 b and 484 d,respectively.

FIG. 14 is a block diagram of a transceiver 600. The transceiver 600includes antenna modules 610, namely a RF signal transmitter 610 t and aRF signal receiver 610 r, as described herein. The RF signal transmitter610 t and the RF signal receiver 610 r are separated by an isolator 602.

The isolator 602 acts to choke surface transmission between the RFsignal transmitter 610 t and RF signal receiver 610 r. The isolator 602is designed for the specific RF signal transmitter 610 t and RF signalreceiver 610 r selected for the transceiver 600. Typically, the isolator602 can provide a range of isolation, such as approximately 40 db to 80db.

As shown in FIG. 14, the transceiver 600 also includes a baseband module616 and a power supply 612 for each of the RF signal transmitter 610 tand RF signal receiver 610 r. The baseband module 616 is divided into atransmitter baseband module 616 t and a receiver baseband module 616 r,and the power supply 612 is divided into a transmitter power supply 612t and a receiver power supply 612 r. However, in some embodiments, thetransmitter baseband module 616 t and the receiver baseband module 616 rcan be provided as one component or more than two components. Similarly,in some embodiments, the transmitter power supply 612 t and the receiverpower supply 612 r can be provided as one component or more than twoseparate components.

FIG. 15a is a perspective view of an antenna module 610′ and FIG. 15b isa top view of a transceiver 600′ mounted with the antenna module 610′shown in FIG. 15 b.

The antenna module 610′ includes a RF signal transmitter 610 t′, a RFsignal receiver 610 r′, and an isolator 602′ separating the RF signaltransmitter 610 t′ and the RF signal receiver 610 r′. In the exampleantenna module 610′ shown in FIG. 15a , the isolator 602′ is implementedwith a corrugated wall design. It will be understood that other designsfor the isolator 602′ may be used.

The transceiver 600′ includes the antenna module 610′ of FIG. 15a , apower supply 612′ with a transmitter power supply 612 t′ and a receiverpower supply 612 r′, a baseband module 616, and a beam steering module618. The baseband module 616 in this example includes SMA™ (SubMiniatureversion A) coax connectors for receiving baseband signal injection andtransmitting baseband signal extraction. The beam steering module 618can be provided on a field-programmable gate array (FPGA™).

A bi-directional data communication system can be formed with a mastertransceiver 700 shown in FIG. 16a and a slave transceiver 750 shown inFIG. 16b . The slave transceiver 750 can be configured to receiveincoming RF data signals from the master transceiver 700 and to transmitoutgoing RF data signals to the master transceiver 700.

The master transceiver 700 includes a RF signal transmitter 710 t and aRF signal receiver 710 r. The RF signal transmitter 710 t and the RFsignal receiver 710 r can be implemented with any of the antenna modules10 described herein. A phase-locked loop 720 can be provided at themaster transceiver 700 for supplying a locked initial carrier signal.The example phase-locked loop 720 includes a sampling phase detector(SPD), a loop amplifier, a VCO and a crystal oscillator.

The slave transceiver 750 also includes a RF signal transmitter 760 tand a RF signal receiver 760 r. The RF signal transmitter 760 t and theRF signal receiver 760 r can be implemented with any of the antennamodules 10 described herein. Similar to the master transceiver 700, theslave transceiver 750 can also include a phase-locked loop 770. Theexample phase-locked loop 770 includes a sampling phase detector (SPD),a loop amplifier, and a VCO.

In some embodiments, the master transceiver 700 can serve one or moreslave transceivers 750 at one time.

The data communication systems described herein can be implemented witha backchannel. FIG. 17 is a block diagram of an example datatransmission system 800 with a backchannel 820.

A primary communication channel 810 can be formed between a RF signaltransmitter 812 and a RF signal receiver 814. The RF signal transmitter812 and the RF signal receiver 814 can be any of the antenna modules 10described herein. In some embodiments, the RF signal receiver 814 caninclude one or more RF signal receivers 814. In some embodiments, the RFsignal receiver 814 can be provided using implementations different fromthose described herein.

The RF signal transmitter 812 can receive the baseband data signal 852from an external input module 822 at an input data port 802. The RFsignal receiver 814 can transmit an output signal 854, which can includethe retrieved baseband data signal 852′ and other data signals, to anexternal phase-lock circuit 824 via an output port 804. The externalinput module 822 and the phase-lock circuit 824 can form the backchannel820.

The phase-lock circuit 824 can analyze the output signal 854 todetermine a quality of the transmission of the baseband data signal852′, and to generate a response signal 856 at an error responseterminal 826. The response signal 856 is transmitted to the input module822. The response signal 856 represents a quality of the datatransmission between the RF signal transmitter 812 and the RF signalreceiver 814. For example, the response signal 856 can include anacknowledgement signal (“ACK”) indicating that the output signal 854 wasreceived, or a negative-acknowledgement signal (“NACK”) indicating anerror occurred during the data transmission.

The backchannel 820 can be implemented with a network that has a lowerbandwidth than the primary communication channel 810. For example, thebackchannel 820 can be implemented using a wireless communicationstechnology (e.g., WLAN, LAN, ethernet or other core network accesslocation etc.) or a mobile communications technology (e.g., 3G, 4G, LTE,etc.).

The substrate for the antenna modules 10 described herein are fabricatedwith a series of layers that form the antenna elements and theinterconnect interface for receiving the RF modules. The alignmentbetween each of the layers is, therefore, critical to the operation ofthe antenna module 10. Registration between each of the layers can befacilitated with, at least, alignment pins, which will be described withreference to FIGS. 18a to 18 c.

FIG. 18a is a top view 900 a of a substrate manufacturing jig 952 for anantenna module 900. FIG. 18b is a side view 900 b of the substratemanufacturing jig 952 and FIG. 18c is a perspective view 900 c of thesubstrate manufacturing jig 952.

In the example substrate manufacturing jig 952, two sets of alignmentpins are provided. A first set 920 of alignment pins, namely 920 a to920 d, are positioned closer to a phased array 960 being formed on afront face 954 than a second set 910 of alignment pins, namely 910 a to910 d, which are located nearly a perimeter of the substratemanufacturing jig 952.

An orientation pin 930 is also provided. The orientation pin 930 may beprovided as an orientation marker.

The sets 910, 920 of alignment pins guide the formation of the substrate952 so that each layer can be positioned with respect to the previouslayer. The orientation pin 930 aides with the orientation of each layerwith respect to the previous layer. It will be understood that theantenna modules may be formed with only one of the sets 910, 920 ofalignment pins.

It will be appreciated that numerous specific details are set forth inorder to provide a thorough understanding of the example embodimentsdescribed herein. However, it will be understood by those of ordinaryskill in the art that the embodiments described herein may be practicedwithout these specific details. In other instances, well-known methods,procedures and components have not been described in detail so as not toobscure the embodiments described herein. Furthermore, this descriptionand the drawings are not to be considered as limiting the scope of theembodiments described herein in any way, but rather as merely describingthe implementation of the various embodiments described herein.

It should be noted that terms of degree such as “substantially”, “about”and “approximately” when used herein mean a reasonable amount ofdeviation of the modified term such that the end result is notsignificantly changed. These terms of degree should be construed asincluding a deviation of the modified term if this deviation would notnegate the meaning of the term it modifies.

In addition, as used herein, the wording “and/or” is intended torepresent an inclusive-or. That is, “X and/or Y” is intended to mean Xor Y or both, for example. As a further example, “X, Y, and/or Z” isintended to mean X or Y or Z or any combination thereof.

It should be noted that the term “coupled” used herein indicates thattwo elements can be directly coupled to one another or coupled to oneanother through one or more intermediate elements.

The embodiments of the systems and methods described herein may beimplemented in hardware or software, or a combination of both. Theseembodiments may be implemented in computer programs executing onprogrammable computers, each computer including at least one processor,a data storage system (including volatile memory or non-volatile memoryor other data storage elements or a combination thereof), and at leastone communication interface.

Various embodiments have been described herein by way of example only.Various modification and variations may be made to these exampleembodiments without departing from the spirit and scope of theinvention, which is limited only by the appended claims.

We claim:
 1. A radio frequency signal transmitter comprising: a datasignal port for receiving a baseband data signal; a carrier signal portfor receiving an initial carrier signal; and an antenna module coupledto each of the data signal port and the carrier signal port, the antennamodule comprising: a substrate having: a front face having a phasedarray of active antenna elements, the phased array of active antennaelements including at least two columns of the active antenna elements;and a rear face opposite the front face, the rear face having, for eachcolumn of active antenna elements, a radio frequency (RF) signallauncher to receive a RF data signal for the column of active antennaelements; and a transmitting module mounted to the rear face of thesubstrate, the transmitting module comprising, for each column of activeantenna elements: a combiner to combine the baseband data signal and aversion of the initial carrier signal to form the RF data signal; and aRF signal port to transmit the RF data signal to the RF signal launcher,wherein: the transmitting module comprises: a frequency multiplier toreceive the initial carrier signal from the carrier signal port and toconvert the initial carrier signal to a second version of the initialcarrier signal, wherein a frequency of the second version of the initialcarrier signal is equal to a frequency of the initial carrier signalmultiplied by a first multiplication factor; and the combiner forms theRF data signal using the baseband data signal and the second version ofthe initial carrier signal.
 2. The device of claim 1, wherein a numberof active antenna elements in each column is a power of two.
 3. Thedevice of claim 1, wherein each column comprises a pair of passiveantenna elements positioned at opposite ends of the column.
 4. Thedevice of claim 1, wherein each column is positioned substantiallyequidistant from a neighboring column.
 5. The device of claim 1, whereineach column comprises at least four active antenna elements.
 6. Thedevice of claim 1, wherein: the frequency multiplier converts the secondversion of the initial carrier signal to a third version of the initialcarrier signal, wherein a frequency of the third version of the initialcarrier signal is equal to the frequency of the initial carrier signalmultiplied by a second multiplication factor; and the combiner forms theRF data signal using the baseband data signal and the third version ofthe initial carrier signal.
 7. The device of claim 6, wherein: thefrequency multiplier comprises a first multiplier stage and a secondmultiplier stage; and for every two columns of the at least two columns,the first multiplier stage comprises a distributed local oscillator forgenerating the second version of the initial carrier signal; and foreach column of the two columns, the second multiplier stage is coupledto the distributed local oscillator to receive the second version of theinitial carrier signal and to generate the third version of the initialcarrier signal.
 8. The device of claim 1, wherein each RF signallauncher comprises a stub for directing the RF data signal to the columnof active antenna elements.
 9. The device of claim 1 further comprisesan enclosure layer mounted to the front face and the enclosure layercomprises a radome.
 10. The device of claim 1 further comprises anenclosure layer mounted to the front face and the enclosure layercomprises a lens positioned to enclose the phased array of antennaelements.
 11. The device of claim 1, wherein the rear face comprises atleast one spacer to maintain a substantially uniform distance betweenthe substrate and the transmitting module.
 12. The device of claim 11,wherein the spacer is positioned at each RF signal launcher.
 13. Thedevice of claims 11, wherein the spacer comprises a solder stop.
 14. Aradio frequency signal receiver comprising: a data signal port fortransmitting a baseband data signal; a carrier signal port for receivingan initial carrier signal; and an antenna module coupled to each of thedata signal port and the carrier signal port, the antenna modulecomprising: a substrate having: a front face having a phased array ofactive antenna elements, the phased array of active antenna elementsincluding at least two columns of the active antenna elements; and arear face opposite the front face, the rear face having, for each columnof active antenna elements, a radio frequency (RF) signal launcher forreceiving a RF data signal from the column of active antenna elements;and a receiving module mounted to the rear face of the substrate, thereceiving module comprising, for each column of active antenna elements:a RF signal port coupled to the RF signal launcher to receive the RFdata signal from the column of active antenna elements; and a detectorto retrieve the baseband data signal from the RF data signal using aversion of the initial carrier signal, wherein the receiving modulecomprises: a frequency multiplier to receive the initial carrier signalfrom the carrier signal port and to convert the initial carrier signalto a second version of the initial carrier signal, wherein a frequencyof the second version of the initial carrier signal is equal to afrequency of the initial carrier signal multiplied by a firstmultiplication factor; and the detector retrieves the baseband datasignal using the second version of the initial carrier signal.
 15. Thedevice of claim 14, wherein a number of active antenna elements in eachcolumn is a power of two.
 16. The device of claim 14, wherein eachcolumn comprises a pair of passive antenna elements positioned atopposed ends of the column.
 17. The device of claim 14, wherein: thefrequency multiplier converts the second version of the initial carriersignal to a third version of the initial carrier signal, wherein afrequency of the third version of the initial carrier signal is equal tothe frequency of the initial carrier signal multiplied by a secondmultiplication factor; and the detector retrieves the baseband datasignal using the third version of the initial carrier signal.
 18. Thedevice of claim 17, wherein: the frequency multiplier comprises a firstmultiplier stage and a second multiplier stage; and for every twocolumns of the at least two columns, the first multiplier stagecomprises a distributed local oscillator for generating the secondversion of the initial carrier signal; and for each column of the twocolumns, the second multiplier stage is coupled to the distributed localoscillator to receive the second version of the initial carrier signaland to generate the third version of the initial carrier signal.
 19. Thedevice of claim 14, wherein each RF signal launcher comprises a stub fordirecting the RF data signal to the RF signal port from the column ofactive antenna elements.
 20. The device of claim 14, further comprisesan enclosure layer mounted to the front face and the enclosure layercomprises a radome.
 21. The device of claim 14, further comprises anenclosure layer mounted to the front face and the enclosure layercomprises a lens positioned to enclose the phased array of antennaelements.
 22. The device of claim 14, wherein the rear face comprises atleast one spacer to maintain a substantially uniform distance betweenthe substrate and the receiving module.
 23. A transceiver comprising: aradio frequency (RF) signal transmitter comprising: a transmitter datasignal port for receiving an outgoing baseband data signal; atransmitter carrier signal port for receiving an initial transmittercarrier signal; a transmitter substrate having: a front face having aphased array of active antenna elements, the phased array of activeantenna elements including at least two columns of the active antennaelements; and a rear face opposite the front face, the rear face having,for each column of active antenna elements, a RF signal launcher toreceive a RF data signal for the column of active antenna elements; anda transmitting module mounted to the rear face of the substrate, thetransmitting module comprising, for each column of active antennaelements: a combiner to combine the outgoing baseband data signal and aversion of the initial transmitter carrier signal to form the RF datasignal; and a RF signal port to transmit the RF data signal to the RFsignal launcher, wherein: the transmitting module comprises: a frequencymultiplier to receive the initial carrier signal from the carrier signalport and to convert the initial carrier signal to a second version ofthe initial carrier signal, wherein a frequency of the second version ofthe initial carrier signal is equal to a frequency of the initialcarrier signal multiplied by a first multiplication factor; and thecombiner forms the RF data signal using the baseband data signal and thesecond version of the initial carrier signal; a RF signal receivercomprising: a receiver data signal port for receiving an incoming RFdata signal; a receiver substrate having: an isolator separating the RFsignal transmitter and the RF signal receiver.